VORAGO Technologies是一家私人控股的无晶圆厂半导体公司，成立于2004年，总部位于德克萨斯州奥斯汀市。 VORAGO是Hi-rel市场的抗辐射和极端温度硬化IC组件供应商。 VORAGO使用其专利的HARDSIL®技术设计和开发高密度SRAM和MCU，同时提供卓越的辐射和耐温性能。 VORAGO还提供定制ASIC设计服务。

VORAGO的专利创新技术HARDSIL已经在多个晶圆厂的多个CMOS工艺中得到验证，无需重新设计即可硬化集成电路，并可扩展到任何一代节点。经过HARDSIL®的修改，商业工艺流程可用于制造功能更强大的CMOS电路，以便在极端环境中实现高度可靠的运行。这种能力极大地提高了高密度IC的硬度和可靠性，并为使用屏蔽COTS，冗余系统或外来封装的当前高可靠性方法提供了破坏性替代方案。

VORAGO将他们的专利HARDSIL®技术融入他们自己的设计和多个德克萨斯仪器产品中，涵盖了多个工艺，VORAGO已成功地在包括高密度SRAM和DSP在内的多种器件中实现了卓越的硬化。由于该技术应用于CMOS工艺级，因此无需进行性能，功耗或电路尺寸权衡。因此，现在可以为系统设计人员提供适用于极端环境的硬化IC组件;在减少外形尺寸的同时具有最高性能的解决方案，同时使用更少的功率。

与德州仪器（TI）合作，VORAGO Technologies于2012年推出其首款产品，QML-V，符合空间要求的抗辐射16Mb SRAM。该产品是唯一一款兼具卓越辐射硬化性能且无性能折衷的抗辐射SRAM产品。

现在，VORAGO还与GLOBALFOUNDRIES合作，正在开发采用HARDSIL®的新产品，为极端环境电子应用提供不断扩展的产品组合。

VORAGO Technologies is a privately held, fabless semiconductor company founded in 2004 and based in Austin, TX. VORAGO is a provider of radiation-hardened and extreme temperature-hardened IC components for the Hi-rel marketplace. VORAGO designs and develops high density SRAMs and MCUs using its patented HARDSIL® technology to simultaneously provide superior radiation and temperature endurance performance. VORAGO also provides custom ASIC design services.

VORAGO's patented, innovative technology, HARDSIL®, has been proven in multiple CMOS process generations at multiple fabs to harden integrated circuits without redesign and is scalable to any generation node. Once modified by HARDSIL®, the commercial process flow can be used to manufacture significantly more robust CMOS circuits for highly reliable operation in extreme environments. This capability dramatically enhances the hardness and reliability of high density ICs and provides a disruptive alternative to current hi-rel approaches utilizing up-screened COTS, redundant systems, or exotic packaging.

Incorporating their patented HARDSIL® technology into their own designs and several Texas Instruments products spanning multiple process generations, VORAGO has successfully demonstrated superior hardening in a number of devices including high density SRAMs and DSPs. Because the technology is applied at the CMOS process-level, no performance, power or circuit size trade-offs are required. As a result, hardened IC components for extreme environments are now within reach for system designers; a solution with the highest performance in reduced form factors while using much less power.

Partnering with Texas Instruments, VORAGO Technologies introduced its first product, a QML-V, space-qualified rad hard 16Mb SRAM, during 2012. This product is the only rad-hard SRAM offering to combine superior radiation hardening with no trade-offs in performance.

Now also partnering with GLOBALFOUNDRIES, VORAGO is developing new products incorporating HARDSIL® to provide an expanding product portfolio for extreme environment electronic applications.